Investigating the Automatic Translation of Korean Honorifics

Luis Cihlar, Minh Duc Bui, Kyung eun Park, Manuel Mager, Walter Bisang, Katharina von der Wense


Abstract
Honorifics encode social hierarchies and relational nuances, making their correct use a culturally sensitive yet challenging aspect of translation. In doing so, they reflect and shape how individuals position themselves and others within a social world. In this work, we investigate how different translation models handle Korean honorifics, both in implicit scenarios, where only the sentence is given, and explicit scenarios. Our findings are as follows: (i) large language models (LLMs) fine-tuned for translation (MTLMs) consistently prefer polite forms more than their instruction-tuned counterparts in both scenarios; (ii) sequence-to-sequence models produce less polite outputs in implicit contexts but shift toward more polite forms when the addressee is explicitly provided; and (iii) both types of LM-based models tend to become more casual when the addressee is known. When compared with human preferences, MTLMs diverge more strongly, exhibiting a systematic overuse of polite forms relative to human judgments.
Anthology ID:
2026.iaai-1.3
Volume:
Proceedings of the Second Workshop of Identity Aware AI
Month:
May
Year:
2026
Address:
Palma de Mallorca, Spain
Editors:
A Pranav, Valerio Basile, Neele Falk, David Jurgens, Gabriella Lapesa, Anne Lauscher, Soda Marem Lo
Venues:
iaai | WS
SIG:
Publisher:
European Language Resources Association
Note:
Pages:
20–31
Language:
External URL:
https://lrec.elra.info/lrec2026-ws-iaai-03
DOI:
10.63317/5g3ca2zi2jf6
Bibkey:
Cite (ACL):
Luis Cihlar, Minh Duc Bui, Kyung eun Park, Manuel Mager, Walter Bisang, and Katharina von der Wense. 2026. Investigating the Automatic Translation of Korean Honorifics. In Proceedings of the Second Workshop of Identity Aware AI, pages 20–31, Palma de Mallorca, Spain. European Language Resources Association.
Cite (Informal):
Investigating the Automatic Translation of Korean Honorifics (Cihlar et al., iaai 2026)
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